Mechanics of Solder Alloy Interconnects

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Januar 1994



The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.


Introduction: the mechanics of soldere alloy interconnect;
Microstructural influences on the mechanical properties of solder;
Interfaces and intermetallics;
Prediction of solder joint geometry;
Life prediction and accelerated testing;
Thermomechanical modeling of solder joints - numerical considerations;
Applications - through-hole;
Surface mount solder joints under thermal, mechanical, and vibration conditions;


John H. Lau received his Ph.D. degree in Theoretical and Applied Mechanics from the University of Illinois (1977), a M.A.Sc. degree in Structural Engineering from the University of British Columbia (1973), a second M.S. degree in Engineering Physics from the University of Wisconsin (1974), and a third M.S. degree in Management Science from Fairleigh Dickinson University (1981). He also has a B.E. degree in Civil Engineering from National Taiwan University (1970). John is an interconnection technology scientist at Agilent Technologies, Inc. His current interests cover a broad range of electronic and optoelectronic packaging and manufacturing technology. Prior to Agilent, he worked for Express Packaging Systems, Hewlett-Packard Company, Sandia National Laboratory, Bechtel Power Corporation, and Exxon Production and Research Company. With more than 30 years of R&D and manufacturing experience in the electronics, petroleum, nuclear, and defense industries, he has given over 200 workshops, authored and co-authored over 180 peer reviewed technical publications, and is the author and editor of numerous books.
EAN: 9780442015053
ISBN: 0442015054
Untertitel: 1994. Auflage. Book. Sprache: Englisch.
Verlag: Springer
Erscheinungsdatum: Januar 1994
Seitenanzahl: 436 Seiten
Format: gebunden
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